发明名称 LED LIGHT SOURCE ASSEMBLY WITH HEAT SINK AND HEAT CONDUCTIVE GLASS COVER
摘要 PROBLEM TO BE SOLVED: To provide an LED assembly with significantly improved heat dissipation and enhanced thermal junction performance, which comprises: an LED light source positioned between a heat sink and a heat conductive glass element; and at least one hold-down element.SOLUTION: A hold-down element 150 of an LED assembly provides compressive force to hold a heat conductive glass element 140 against an LED light source 120, thereby pressing the LED light source 120 against a heat sink reflector 130. A 1/8 inch glass element with a surface area of five times the LED diffuser surface area is held over the LED light source 120 by one or more spring wires 152 inserted through holes in the heat sink.
申请公布号 JP2015062188(A) 申请公布日期 2015.04.02
申请号 JP20140222455 申请日期 2014.10.31
申请人 RINGDALE INC 发明人 KLAUS BOLLMANN;TOM PENICK
分类号 F21V29/00;F21V19/00;H01L33/64 主分类号 F21V29/00
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