| 摘要 |
<p>The present invention provides a film for a vacuum thermal insulator, the film comprising: an interruption layer comprising at least two metal interruption layers, which have metal layers formed thereon, stacked on a surface of a substrate film by a first attachment layer; a heat bonding layer stacked on a surface of the interruption layer by a second attachment layer, the substrate film constituting the outermost layer of the opposite surface to the surface on which the heat bonding layer is stacked; and a first protection layer formed on a surface of at least one of the metal interruption layers. The present invention can substantially improve thermal insulation performance and gas interruption property and simultaneously prevent degradation of performance resulting from generation of pinholes during metal deposition.</p> |
