发明名称 |
Through-Assembly Via Modules and Methods for Forming the Same |
摘要 |
A discrete Through-Assembly Via (TAV) module includes a substrate, and vias extending from a surface of the substrate into the substrate. The TAV module is free from conductive features in contact with one end of each of the conductive vias. |
申请公布号 |
US2015093881(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
US201414567027 |
申请日期 |
2014.12.11 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chen Chih-Hua;Chen Chen-Shien;Hsiao Ching-Wen |
分类号 |
H01L21/768;H01L21/78 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
forming a plurality of through-vias extending from a top surface of a substrate in a wafer into the substrate; forming a plurality of through-strips extending from the top surface of the substrate into the substrate, wherein the plurality of through-strips is parallel to each other, and wherein lengths of the plurality of through-strips are greater than widths of the plurality of through-strips; forming a plurality of redistribution lines over and connected to the plurality of through-vias; performing a backside grinding on a back surface of the substrate; and performing a die-saw on the wafer to cut the wafer into a plurality of dies. |
地址 |
Hsin-Chu TW |