发明名称 |
Polishing And Electroless Nickel Compositions, Kits, And Methods |
摘要 |
Disclosed are various methods, kits, and compositions in the field of electroless nickel plating and chemical polishing. An electroless nickel plating composition may include a surfactant-brightener; a coupler; a bismuth metallic stabilizer; and organosulfur stabilizer and a bismuth complexer. Prior to plating, a substrate may be polished with a polishing composition that includes a surface blocker and a surface leveler. When practiced in accordance with the preferred teachings described herein, the electroless nickel plating composition is capable of providing a mirror-bright, lustrous finish, and has good leveling properties. The composition may be made without lead or cadmium. |
申请公布号 |
US2015093514(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
US201414562918 |
申请日期 |
2014.12.08 |
申请人 |
Accu-Labs, Inc. |
发明人 |
Tremmel Peter;Broch Orville;Cornwell Stephen Brent |
分类号 |
C23C18/36;C23C18/16;B65D81/32;C23C18/34 |
主分类号 |
C23C18/36 |
代理机构 |
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代理人 |
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主权项 |
1. A kit comprising:
a first container containing a first composition and a second container containing a second composition, said first composition containing nickel and said second composition containing a reducing agent, said first and second compositions being combinable to form an electroless nickel plating composition; said first composition containing a surfactant-brightener, said surfactant-brightener being present in an amount effective to enhance luster of an object plated with said electroless nickel plating composition, and a coupler, said coupler being present in an amount effective to inhibit oil-out of said surfactant-brightener. |
地址 |
Chicago IL US |