发明名称 PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
摘要 A manufacturing method of a package carrier includes the following steps. Firstly, two base metal layers are bonded together. Then, two supporting layers are laminated onto the base metal layers respectively. Next, two release metal films are disposed on the supporting layers respectively, wherein each of the release metal films includes a first metal film and a second metal film separable from each other. Next, two patterned metal layers are formed on the release metal films respectively, wherein each of the patterned metal layers is suitable for carrying and electrically connected to a chip. Then, the base metal layers are separated from each other to form two package carriers independent from each other. A package carrier formed by the manufacturing method described above is also provided.
申请公布号 US2015090481(A1) 申请公布日期 2015.04.02
申请号 US201314086987 申请日期 2013.11.22
申请人 Sun Shih-Hao 发明人 Sun Shih-Hao
分类号 H01L23/00;H05K1/09;H05K13/04;H05K1/11 主分类号 H01L23/00
代理机构 代理人
主权项 1. A manufacturing method of a package carrier, comprising: bonding two base metal layers; laminating two supporting layers onto the base metal layers respectively; disposing two release metal films on the supporting layers respectively, wherein each of the release metal films comprises a first metal foil and a second metal foil separable from each other; forming two patterned metal layers on the release metal films respectively, wherein each of the patterned metal layers is capable of carrying and electrically connected to a chip; and separating the two base metal layers from each other to form two package carriers independent from each other.
地址 Hsinchu County TW