PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

摘要

A manufacturing method of a package carrier includes the following steps. Two base metal layers are bonded together. Two supporting layers are laminated onto the base metal layers respectively. Two release metal films are disposed on the supporting layers respectively. Each release metal film includes a first metal film and a second metal film separable from each other. Two first patterned metal layers are formed on the release metal films respectively. Each first patterned metal layer includes a pad pattern. Two dielectric layers are formed on the release metal films respectively and cover the corresponding first patterned metal layers. Each dielectric layer has a conductive via connecting to the corresponding pad pattern. Two second patterned metal layers are formed on the dielectric layers respectively. Each second patterned metal layer at least covers the conductive via. The base metal layers are separated from each other to form two independent package carriers.

主权项

1. A manufacturing method of a package carrier, comprising:
bonding two base metal layers to each other; laminating two supporting layers onto the two base metal layers respectively; disposing two release metal films on the two supporting layers respectively, wherein each of the release metal films comprises a first metal film and a second metal film that are separable from each other; forming two first patterned metal layers on the two release metal films respectively, wherein each of the first patterned metal layers comprises at least one pad pattern; forming two dielectric layers on the two release metal films respectively and covering the corresponding first patterned metal layers, wherein each of the dielectric layers comprises at least one conductive via respectively connecting the corresponding pad pattern; forming two second patterned metal layers on the two dielectric layers respectively, wherein each of the second patterned metal layers at least covers a top surface of the corresponding conductive via; and separating the two base metal layers from each other to form two package carriers independent from each other.