EPOXY RESIN COMPOSITION FOR USE IN SEALING OF SEMICONDUCTORS, AND SEMICONDUCTOR-PACKAGED STRUCTURE AND METHOD FOR PRODUCING SAME

摘要

An epoxy resin composition for use in the sealing of semiconductors, which comprises (A) 100 parts by mass of an epoxy resin containing 10 to 45% by mass of a novolac-type epoxy resin, (B) 50 to 150 parts by mass of an acid anhydride, (C) 2 to 12 parts by mass of a curing accelerator, (D) 5 to 50 parts by mass of a silicone gel or a silicone oil and (E) spherical fused silica having an average particle diameter of 2 to 30 μm, wherein the content of the fused silica (E) is 80 to 92% by mass and the viscosity of the epoxy resin composition is 1000 Pa·s or less at 25ºC and a shear rate of 2.5 (1/s).