发明名称 EPOXY RESIN COMPOSITION, SEALING MATERIAL, CURED PRODUCT THEREOF, AND PHENOL RESIN
摘要 [Solution] An epoxy resin composition characterized by containing at least an epoxy resin and a phenol resin indicated by a specified chemical formula (1). This epoxy resin composition ideally also contains an inorganic filler material. Also, the mixing ratio for the inorganic filler material in the epoxy resin composition (mass of inorganic filler material/mass of epoxy resin composition including inorganic filler material) is ideally 70-95 % by mass. In addition, ideally, the epoxy resin composition contains a solvent and the epoxy resin and the phenol resin are uniformly dissolved in the solvent.
申请公布号 WO2015046398(A1) 申请公布日期 2015.04.02
申请号 WO2014JP75560 申请日期 2014.09.26
申请人 MEIWA PLASTIC INDUSTRIES, LTD. 发明人 HANABUSA, HINAKO;OKAMOTO, SHINJI;SHINODA, KYOUICHI
分类号 C08G59/62;C08G8/10;H01L23/29;H01L23/31 主分类号 C08G59/62
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