发明名称 |
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE |
摘要 |
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof. |
申请公布号 |
WO2015044800(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
WO2014IB62985 |
申请日期 |
2014.07.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM JAPAN, LTD. |
发明人 |
CORBIN, DAMYON L.;MUSANTE, CHARES F. |
分类号 |
H01L21/673;B65D81/02;B65D85/30 |
主分类号 |
H01L21/673 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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