| 摘要 |
There is provided an optical imaging apparatus module (117.1) for use in an optical imaging apparatus, in particular, for microlithography, comprising an optical element support substructure (118.1), and an auxiliary support sub-structure (119.1). The optical element support sub-structure is configured to support an optical element (106.2) and has a first temporary support interface arrangement. The optical element is configured to form part of a group of optical elements of the optical imaging apparatus configured to transfer, in an exposure process using exposure light, an image of a pattern of a mask onto a substrate. The auxiliary support substructure (119.1) is configured to support an auxiliary component (115) and has a second temporary support interface arrangement, the auxiliary component being configured to execute, during the exposure process, an auxiliary function of the exposure process other than transferring the image of the pattern onto the substrate. The auxiliary component (115) is configured to be, during the exposure process, spatially associated to the optical element and supported by an auxiliary support structure comprising the auxiliary support sub-structure (119.1) in a manner mechanically decoupled from the optical element support sub-structure (118.1). The first temporary support interface arrangement and the second temporary support interface arrangement are configured to releasably cooperate with at least one temporary connecting device (121) configured to temporarily support the auxiliary support sub-structure (119.1) via the optical element support sub-structure (118.1) at least during assembly of the optical imaging apparatus. |
