| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive, bonding method and apparatus for bonding an electrostatic chuck to a component of a substrate support.SOLUTION: An adhesive 204 for bonding an electrostatic chuck 126 to a component 202 of a substrate support includes a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may have a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content &Sgr;D3-D10 of less than about 500 ppm. The filler accounts for about 50 to about 70 percent by volume of the adhesive layer, and may comprise particles of aluminum oxide (AlO), aluminum nitride (AlN), yttrium oxide (YO), or combinations thereof. Further, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns. |
