发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing method and a polishing device capable of reducing the consumption of a polishing liquid while maintaining a relatively high polishing rate.SOLUTION: In a polishing method where a polishing object is pressed to a polishing surface 52a with a top ring while supplying a polishing liquid from a polishing liquid supply port 108a to the polishing surface 52a of a polishing table 22 and the polishing object is polished while rotating the top ring holding the polishing object and the polishing surface 52a, the polishing liquid supply port 108a is moved when rotating the top ring in a high speed rotation region in which polishing rate distribution at the center of the polishing object is lower than that of an edge part.
申请公布号 JP2015061739(A) 申请公布日期 2015.04.02
申请号 JP20140242071 申请日期 2014.11.28
申请人 EBARA CORP 发明人 ISHII YU;SHIOKAWA YOICHI;HIRAANA TSUNEHITO
分类号 B24B37/00;B24B37/32;H01L21/304 主分类号 B24B37/00
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