PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that suppresses degradation by light in a cured product while containing a resin component having an aromatic ring and that is suitably used for forming a solder resist layer.SOLUTION: A resin component comprising the following component (A) is included in the photosensitive resin composition, in which a percentage of aromatic rings with respect to the whole resin component is controlled to a range from 0.1 to 50 mass%. The component (A) is a photosensitive resin having at least two ethylenically unsaturated groups in one molecule. Thereby, favorable characteristics of a cured product formed from the photosensitive resin composition are maintained by using the resin component having an aromatic ring, as well as degradation by light of the cured product and yellowing of the cured product can be suppressed by controlling an amount of aromatic rings in the resin component to a specific range.