发明名称 |
TEMPORARY ADHESIVE FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND ADHESIVE SUPPORT AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive layer formed from the temporary adhesive for production of semiconductor device, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive for production of semiconductor device as claimed; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer. |
申请公布号 |
US2015093879(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
US201414567471 |
申请日期 |
2014.12.11 |
申请人 |
FUJIFILM Corporation |
发明人 |
FUJIMAKI Kazuhiro;KOYAMA Ichiro;NAKAMURA Atsushi;IWAI Yu;TAN Shiro |
分类号 |
C09J7/02;H01L21/302;H01L21/683 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
1. A temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent. |
地址 |
Tokyo JP |