| 发明名称 |
Electronic Component, Arrangement and Method |
| 摘要 |
An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure. The semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step. An outer contact pad of the redistribution structure is arranged on the step. |
| 申请公布号 |
US2015091176(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201314043185 |
申请日期 |
2013.10.01 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
Otremba Ralf;Höglauer Josef;Schredl Jürgen;Schlögel Xaver;Schiess Klaus |
| 分类号 |
H01L23/13;H01L23/48;H01L25/065;H01L23/00 |
主分类号 |
H01L23/13 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component, comprising:
at least one semiconductor device; and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure, wherein the semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step and an outer contact pad of the redistribution structure is arranged on the step. |
| 地址 |
Villiach AT |
