发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND POWER SUPPLY APPARATUS
摘要 A semiconductor device includes an electrode material diffusion suppression layer provided either between a gate electrode and a gate insulation film, between Al-containing ohmic electrodes and an Au interconnection, and below the gate electrode and above the Al-containing ohmic electrodes, the electrode material diffusion suppression layer having a structure wherein a first the TaN layer, a Ta layer, and a second the TaN layer are stacked in sequence.
申请公布号 US2015091173(A1) 申请公布日期 2015.04.02
申请号 US201414566816 申请日期 2014.12.11
申请人 FUJITSU LIMITED 发明人 KAMADA Youichi
分类号 H01L23/532;H01L21/8234;H01L21/768;H01L29/45;H01L29/49 主分类号 H01L23/532
代理机构 代理人
主权项 1. A semiconductor device comprising: an ohmic electrode comprising an Al layer; an Au interconnection; and an electrode material diffusion suppression layer, provided between the Al layer and the Au interconnection, comprising a first TaN layer, a Ta layer, and a second TaN layer stacked in sequence.
地址 Kawasaki-shi JP