发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND POWER SUPPLY APPARATUS |
摘要 |
A semiconductor device includes an electrode material diffusion suppression layer provided either between a gate electrode and a gate insulation film, between Al-containing ohmic electrodes and an Au interconnection, and below the gate electrode and above the Al-containing ohmic electrodes, the electrode material diffusion suppression layer having a structure wherein a first the TaN layer, a Ta layer, and a second the TaN layer are stacked in sequence. |
申请公布号 |
US2015091173(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
US201414566816 |
申请日期 |
2014.12.11 |
申请人 |
FUJITSU LIMITED |
发明人 |
KAMADA Youichi |
分类号 |
H01L23/532;H01L21/8234;H01L21/768;H01L29/45;H01L29/49 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
an ohmic electrode comprising an Al layer; an Au interconnection; and an electrode material diffusion suppression layer, provided between the Al layer and the Au interconnection, comprising a first TaN layer, a Ta layer, and a second TaN layer stacked in sequence. |
地址 |
Kawasaki-shi JP |