| 摘要 |
A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first surface, includes signal electrodes, power-supply electrodes and ground electrodes, which connect to pads on the first surface of the insulating substrate. Lands provided on the second surface of the insulating substrate include signal lands, power-supply lands and ground lands through vias penetrate from the first surface to the second surface of the insulating substrate, and include signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands. At least one of the signal vias are closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias. |
| 主权项 |
1. A semiconductor device comprising:
an insulating substrate including a first surface and a second surface opposite to the first surface; a semiconductor chip including a plurality of first electrodes thereon, the semiconductor chip being mounted over the first surface of the insulating substrate, the first electrodes including signal electrodes, power-supply electrodes and ground electrodes; a plurality of connection pads provided on the first surface of the insulating substrate, the connection pads including signal connection pads electrically connected to the signal electrodes, power-supply connection pads electrically connected to the power-supply electrodes and ground connection pads electrically connected to the ground electrodes; a plurality of lands provided on the second surface of the insulating substrate, the lands including signal lands, power-supply lands and ground lands; and a plurality of through vias penetrated from the first surface to the second surface of the insulating substrate, the through vias including signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands, at least one of the signal vias being closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias. |
