| 发明名称 |
LIGHT EMITTING DIODE PACKAGE STRUCTURE |
| 摘要 |
A light emitting diode package structure is provided. The light emitting diode package structure includes at least one light emitting diode unit, an encapsulating body and at least one isolation film. The encapsulating body includes a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed. The at least one isolation film is formed on the exposed surfaces. Wherein the isolation film blocks or reflects a portion of light emitted from the light emitting diode unit. |
| 申请公布号 |
US2015091026(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201414305000 |
申请日期 |
2014.06.16 |
| 申请人 |
PROLIGHT OPTO TECHNOLOGY CORPORATION |
发明人 |
HSING CHEN Chen-Lun;HUNG Jung-Hao;LIN Ding-Yao |
| 分类号 |
H01L27/15;H01L33/40 |
主分类号 |
H01L27/15 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode package structure, comprising:
at least one light emitting diode unit; an encapsulating body comprising a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed; and at least one isolation film formed on the exposed surfaces; wherein the isolation blocks or reflects a portion of light emitted from the light emitting diode unit. |
| 地址 |
TaoYuan County TW |
