发明名称 INFRARED INSPECTION DEVICE AND INFRARED INSPECTION METHOD
摘要 <p>The present invention is a device and method in which even if transient temporal variation in radiation energy is being acquired, flaw and bonding-state inspection is carried out without the use of a relatively fast infrared camera. An infrared inspection device (1A) has a pulse laser (2) for irradiating laser light onto an area under inspection on the surface of an object, an infrared camera (8) for detecting infrared radiation generated from the area under inspection on the surface of the object as a result of the irradiation of laser light by the pulse laser (2), a synchronization unit (10) and irradiation timing control unit (7) for controlling the detection timing of an infrared camera (8) and the irradiation timing of the laser light, and an image generation unit (11) for generating an image including the temperature variation and temperature distribution of the area under inspection that were detected by the infrared camera (8). In addition, the infrared inspection device (1A) has a flaw identification unit (12) for identifying weld flaws on the basis of the image generated by the image generation unit (11) that includes the temperature variation and temperature distribution of the area under inspection.</p>
申请公布号 WO2015045751(A1) 申请公布日期 2015.04.02
申请号 WO2014JP72972 申请日期 2014.09.02
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 SASAZAWA, HIDEAKI;YOSHITAKE, YASUHIRO;TEZUKA, HIDEKAZU;SAITO, YOSHIHIRO
分类号 G01N25/72 主分类号 G01N25/72
代理机构 代理人
主权项
地址