| 发明名称 |
RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCENT ELEMENT, SEALING FILM FOR ORGANIC ELECTROLUMINESCENT ELEMENT, GAS-BARRIER FILM FOR ORGANIC ELECTROLUMINESCENT ELEMENT, AND ORGANIC ELECTROLUMINESCENT ELEMENT USING THESE FILMS |
| 摘要 |
A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin. |
| 申请公布号 |
US2015091436(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201414566961 |
申请日期 |
2014.12.11 |
| 申请人 |
FURUKAWA ELECTRIC CO., LTD. |
发明人 |
MIHARA Naoaki;ISHIGURO Kunihiko;NAKAMURA Toshimitsu;MIEDA Tetsuya |
| 分类号 |
H05B33/04;C08L67/02 |
主分类号 |
H05B33/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition for sealing an organic electroluminescent element, comprising:
at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, wherein the content of the at least one epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the at least one polyester resin. |
| 地址 |
Tokyo JP |
