发明名称 |
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (MEMS) |
摘要 |
Stress buffer layers for integrated microelectromechanical systems (MEMS) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts. A microelectromechanical system (MEMS) component is disposed above the first surface of the substrate. A buffer layer is disposed above the MEMS component, the buffer layer having a first Young's modulus. A mold compound is disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus. |
申请公布号 |
US2015091167(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
US201314039157 |
申请日期 |
2013.09.27 |
申请人 |
Geissler Christian;Meyer Thorsten;Ofner Gerald;Mahnkopf Reinhard;Augustin Andreas;Mueller Christian |
发明人 |
Geissler Christian;Meyer Thorsten;Ofner Gerald;Mahnkopf Reinhard;Augustin Andreas;Mueller Christian |
分类号 |
B81C1/00;B81B7/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor package, comprising:
a substrate comprising first and second surfaces, the second surface comprising an array of external conductive contacts; a microelectromechanical system (MEMS) component disposed above the first surface of the substrate; a buffer layer disposed above the MEMS component, the buffer layer having a first Young's modulus; and a mold compound disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus. |
地址 |
Teugn DE |