3D DEVICE PACKAGING USING THROUGH-SUBSTRATE POSTS

摘要

A method for 3D device packaging utilizes through-substrate metal posts to mechanically and electrically bond two or more dice. The first die includes a set of access holes extending from a surface of the first die to a set of pads at a metal layer of the first die. The second die includes a set of metal posts. The first die and the second die are stacked such that each metal post extends from a surface of the second die toward a corresponding pad via a corresponding access hole. The first die and second die are mechanically and electrically bonded via solder joints formed between the metal posts and the corresponding pads.

主权项

1. A method comprising:
stacking a first die with a second die, the first die comprising a first set of access holes extending from a first surface of the first die to a first set of pads at a metal layer of the first die and the second die comprising a first set of metal posts, each metal post of the first set of metal posts extending from a surface of the second die toward a first surface of a corresponding pad of the first set of pads via a corresponding access hole of the first set of access holes; and bonding the first die and the second die such that the metal posts of the first set of metal posts are electrically coupled to the corresponding pads of the first set of pads.