ENDOSCOPE DEVICE

摘要

This endoscope device is characterized by being provided with: a solid-state imaging element having, provided at a surface thereof, a light-reception surface; a substrate which is disposed at a rear-surface side of the solid-state imaging element, and which has a section of a wiring pattern thereof exposed at a tip side, i.e. a solid-state imaging element side; a first heat-dissipation member disposed between the solid-state imaging element and the exposed section of the wiring pattern; and a cable which is electrically connected with the wiring pattern.