| 摘要 |
This invention provides: an underfill material that allows void-free mounting and good soldering performance; and a method for manufacturing a semiconductor device using said underfill material. Said underfill material contains an epoxy resin and a hardener. The reaction rate of said underfill material at 240°C, computed via the Ozawa method using a differential scanning calorimeter, takes at most 2.0 s to reach 20% and at least 3.0 s to reach 60%. The use of said underfill material allows void-free mounting and good soldering performance. |
