发明名称 Composite Substrate, Piezoelectric Device, and Method for Manufacturing Composite Substrate
摘要 A composite substrate 10 includes a piezoelectric substrate 12 and a support layer 14 bonded to the piezoelectric substrate 12. The support layer 14 is made of a material having no crystalline anisotropy in a bonded surface thereof and has a smaller thickness than the piezoelectric substrate 12. The piezoelectric substrate 12 and the support layer 14 are bonded together with an adhesive layer 16 therebetween. The composite substrate 10 has a total thickness of 180 μm or less. The base thickness ratio Tr=t2/(t1+t2) is 0.1 to 0.4, where t1 is the thickness of the piezoelectric substrate 12, and t2 is the thickness of the support layer 14. The thickness t1 is 100 μm or less. The thickness t2 is 50 μm or less.
申请公布号 US2015091416(A1) 申请公布日期 2015.04.02
申请号 US201414565902 申请日期 2014.12.10
申请人 NGK INSULATORS, LTD. 发明人 Hori Yuji;Tai Tomoyoshi;Hamajima Akira;Nakahara Toshinao
分类号 H01L41/08;H01L41/22 主分类号 H01L41/08
代理机构 代理人
主权项 1. A composite substrate comprising: a piezoelectric substrate; and a support layer bonded to the piezoelectric substrate, the support layer comprising a material having no crystalline anisotropy in a bonded surface thereof and having a thickness smaller than or equal to the thickness of the piezoelectric substrate.
地址 Aichi JP