SYSTEM FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBSTRATE

摘要

A system and method for removing an electronic component from a substrate is described. In one embodiment, a system includes a heating device to heat a substrate, wherein an electronic component such as a microchip is attached to the substrate by one or more solder connections. A thermally conductive picker head is placed in physical contact with the electronic component to apply tension to the electronic component and draw heat away from the electronic component through a thermally conductive interface between the electronic component and the thermally conductive picker head. This ideally generates a uniform temperature gradient across the solder connections. This will allow the electronic component along with most or all of the solder to be removed from the substrate.

主权项

1. A system for removing an electronic component from a substrate, the system comprising:
a heating device to heat a substrate, wherein an electronic component is attached to the substrate by at least one solder connection; and a thermally conductive picker head to apply tension to the electronic component while drawing heat away from the electronic component through a thermally conductive interface between the electronic component and the thermally conductive picker head.