SURFACE-TREATED COPPER FOIL AND LAMINATED BOARD, COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING SAME, AS WELL AS METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a surface-treated copper foil which adheres suitably to a resin, is excellent in transparency of a resin after removing the copper foil by etching and has less transmission loss of signal and to provide a laminated board using the same.SOLUTION: There is provided a surface-treated copper foil in which roughened particles are formed on one surface of the copper foil and/or both surfaces of the copper foil by a roughening treatment, wherein in roughened particles on the roughening-treated surface, 50 pieces/μmor more of roughened particles having a major diameter of 100 nm or less per unit surface area are formed and the 60-degree glossiness of MD of the roughening-treated surface is 76 to 350%, the roughening-treated surface contains one or more elements selected from the group consisting of Ni and Co, when the roughening-treated surface contains Ni, the adhesion amount of Ni is 1400 μg/dmor less and when the roughening-treated surface contains Co, the adhesion amount of Co is 2400 μg/dmor less.