| 摘要 |
PROBLEM TO BE SOLVED: To provide a paste composition which makes possible to readily and efficiently manufacture a metalized substrate having a wiring pattern with higher precision and higher definition.SOLUTION: A composition is used for printing on a nitride ceramic sintered compact substrate to form a wiring pattern. The composition comprises: 100 pts.mass of copper powder; 1 pts.mass or more and 10 pts.mass or less of hydrogenated titanium powder having an average particle diameter of 0.1 μm or more and 20 μm or less; and 1 pts.mass or more and 10 pts.mass or less of a binder resin. The copper powder is composed of copper powder A having an average particle diameter of 0.2 μm or more and 0.6 μm or less, or mixed powder including, by 30 pts.mass or more to less than 100 pts.mass, the copper powder A with the balance consisting of copper powder B having an average particle diameter of 1.0 μm or more and 5.0 μm or less. The composition has a thixotropy index of 0.2 or more and 1.0 or less. |
