发明名称 |
METHOD AND APPARATUS FOR PROCESSING SAPPHIRE |
摘要 |
A method of producing a sapphire product from a suitable precursor material is disclosed. The method comprising the steps of placing a sapphire product precursor on a support apparatus of a crystalline material processing assembly further comprising at least one cutting tool and two or more x-ray module fixedly positioned around the product precursor. The support apparatus can be tilted and rotated in order to align the crystalline plane orientations to a fixed cutting direction, and the sapphire product can be produced by cutting in that direction. |
申请公布号 |
US2015090245(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
US201414488715 |
申请日期 |
2014.09.17 |
申请人 |
GT Crystal Systems, LLC |
发明人 |
Highfill James N.;Huard Scott |
分类号 |
B28D5/00 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method of producing a sapphire product comprising the steps of:
i) providing a sapphire product precursor having a first crystalline plane orientation and a second crystalline plane orientation; ii) providing a crystalline material processing assembly comprising
a) at least one cutting tool configured to cut the sapphire product precursor along a fixed cutting direction;b) a first x-ray module fixedly positioned at a first angle relative to the fixed cutting direction and configured to determine alignment of the first crystalline plane of the sapphire product precursor to the fixed cutting direction;c) a second x-ray module fixedly positioned at a second angle relative to the fixed cutting direction and configured to determine alignment of the second crystalline plane of the sapphire product precursor to the fixed cutting direction; andd) a support apparatus for the sapphire product precursor tiltable and rotatable relative to the fixed cutting direction; iii) placing the sapphire product precursor on the support apparatus in a position to be cut by the cutting tool along the fixed cutting direction; iv) establishing alignment of the first crystalline plane and of the second crystalline plane of the sapphire product precursor with the fixed cutting direction; and v) cutting the sapphire product precursor along the fixed cutting direction to produce the sapphire product. |
地址 |
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