| 摘要 |
This semiconductor device manufacturing method includes: a step (A) for preparing a sheet-like resin composition-attached chip that has a sheet-like resin composition bonded to a semiconductor chip; a step (B) for preparing a body to which the chip is to be bonded; a step (C) for bonding, to the body, the sheet-like resin composition-attached chip by having the sheet-like resin composition as a bonding surface; a step (D) for semi-curing the sheet-like resin composition by heating the composition after the step (C); and a step (E) for curing the sheet-like resin composition by heating, after the step (D), the composition at a temperature that is higher than a heating temperature in the step (D). |
