POLISHING COMPOSITION, POLISHING METHOD, AND SUBSTRATE PRODUCTION METHOD

摘要

A polishing composition according to the present invention can be used for polishing an object of interest having a polysilicon-containing layer, comprises abrasives grain and an oxidizing agent, and has a pH value of 6 or more. It is preferred that colloidal silica is used as the abrasive grains. A polishing method according to the present invention is characterized by polishing an object of interest having a polysilicon-containing layer using the polishing composition. A substrate production method according to the present invention is characterized by comprising a polishing step of polishing a substrate having a polysilicon-containing layer by the polishing method.