3D DEVICE PACKAGING USING THROUGH-SUBSTRATE POSTS

摘要

A method for 3D device packaging utilizes through-hole metal post techniques to mechanically and electrically bond two or more dice. The first die includes a set of through-holes extending from a first surface of the first die to a second surface of the first die. The second die includes a third surface and a set of metal posts. The first die and the second die are stacked such that the third surface of the second die faces the second surface of the first die, and each metal post extends through a corresponding through-hole to a point beyond the first surface of the first die, electrically coupling the first die and the second die.

主权项

1. A device package comprising:
a first die comprising:
a first set of through-holes in a first arrangement, each through-hole of the first set of through-holes extending between a first surface of the first die and a second surface of the first die; and a second die comprising:
a first set of metal posts disposed at a third surface of the second die in a second arrangement corresponding to the first arrangement, the third surface facing the second surface, and each metal post of the first set of metal posts extending through a corresponding through-hole of the first set of through-holes to a point beyond the first surface of the first die.