METHOD OF FABRICATING PRINTED CIRCUIT BOARD (PCB) SUBSTRATE HAVING A CAVITY

摘要

A method is provided for fabricating a substrate having multiple metal layers separated by one or more dielectric layers, respectively. The method includes forming a cavity in at least one dielectric layer through an exposed portion of a top dielectric layer of the substrate, applying metal to side and bottom surfaces of the cavity, forming a pattern through a portion of the metal applied to the bottom surface of the cavity, and micro-etching the metal applied to the bottom surface of the cavity. The micro-etching extends the pattern through a remaining portion of the metal applied to the bottom surface of the cavity.

主权项

1. A method of fabricating a substrate having a plurality of metal layers separated by one or more dielectric layers, the method comprising:
forming a cavity in at least one dielectric layer through an exposed portion of a top dielectric layer of the substrate; applying metal to side and bottom surfaces of the cavity; forming a pattern through a portion of the metal applied to the bottom surface of the cavity; and micro-etching the metal applied to the bottom surface of the cavity, the micro-etching extending the pattern through a remaining portion of the metal applied to the bottom surface of the cavity.