SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

摘要

A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.

主权项

1. A substrate processing device comprising:
a cleaning water supply unit supplying a cleaning water to a surface of a substrate; and a solvent supply unit supplying a volatile solvent to the surface of the substrate supplied with the cleaning water, and replacing the cleaning water on the surface of the substrate with the volatile solvent, wherein the substrate processing device further comprises a water removing unit, and when the solvent supply unit supplies the volatile solvent to the surface of the substrate, the water removing unit supplies a water removing agent to the surface of the substrate, and promotes the replacement of the cleaning water on the surface of the substrate with the volatile solvent.