| 发明名称 |
Transducer arrangement comprising a transducer die and method of covering a transducer die |
| 摘要 |
According to an exemplary aspect a transducer arrangement comprising a supporting structure; a transducer die arranged on the supporting structure; and a lid comprising a porous material connected to the supporting structure and arranged to at least partially cover the transducer die. |
| 申请公布号 |
US2015090030(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201314039365 |
申请日期 |
2013.09.27 |
| 申请人 |
Infineon Technologies AG |
发明人 |
THEUSS Horst |
| 分类号 |
G01D11/24;H01L21/52 |
主分类号 |
G01D11/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A transducer arrangement comprising:
a supporting structure; a transducer die arranged on the supporting structure; a lid comprising a porous material connected to the supporting structure and arranged to at least partially cover the transducer die. |
| 地址 |
Neubiberg DE |
