摘要 |
Provided are an electronic-component production method and electronic-component production device which make it possible to easily align a position by inserting a layered chip into a cavity formed in a pallet, and to form an external electrode having high dimensional accuracy. This electronic-component production method involves aligning the positions of a plurality of layered chips (20) by inserting each of the plurality of layered chips (20), which are configured from a layered body comprising a plurality of ceramic layers and a plurality of internal electrode layers, into a plurality of cavities (11) formed in a pallet (10), and pressing each of the plurality of layered chips (20) against one inner-wall surface which forms part of a cavity (11). An external electrode is formed on the plurality of layered chips (20) by applying a coat of conductive ink (31) to the end sections of the plurality of position-aligned layered chips (20), including the upper surface of the pallet (10), and then drying the coat of conductive ink (31). |