发明名称 ELECTRONIC-COMPONENT PRODUCTION METHOD AND ELECTRONIC-COMPONENT PRODUCTION DEVICE
摘要 Provided are an electronic-component production method and electronic-component production device which make it possible to easily align a position by inserting a layered chip into a cavity formed in a pallet, and to form an external electrode having high dimensional accuracy. This electronic-component production method involves aligning the positions of a plurality of layered chips (20) by inserting each of the plurality of layered chips (20), which are configured from a layered body comprising a plurality of ceramic layers and a plurality of internal electrode layers, into a plurality of cavities (11) formed in a pallet (10), and pressing each of the plurality of layered chips (20) against one inner-wall surface which forms part of a cavity (11). An external electrode is formed on the plurality of layered chips (20) by applying a coat of conductive ink (31) to the end sections of the plurality of position-aligned layered chips (20), including the upper surface of the pallet (10), and then drying the coat of conductive ink (31).
申请公布号 WO2015046042(A1) 申请公布日期 2015.04.02
申请号 WO2014JP74811 申请日期 2014.09.19
申请人 MURATA MANUFACTURING CO.,LTD. 发明人 GOTO SEIJI;HIRAO TAKAHIRO
分类号 H01G13/00;H01G4/12;H01G4/30;H03H3/02;H03H3/08 主分类号 H01G13/00
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