| 摘要 |
PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition that exhibits good sensitivity and resolution and imparts sufficient chemical resistance, heat resistance and mechanical characteristics even when heat-treated at a low temperature of 220°C or lower.SOLUTION: There is provided a negative photosensitive resin composition comprising: (a) a polybenzoxazole precursor having a repeating unit represented by general formula (I); (b) a compound that generates an acid by irradiation with actinic rays in a wavelength region from 365 to 700 nm; (c) a compound that can crosslink or polymerize with the component (a) by an action of an acid; and (d) a compound that has no absorption in a wavelength region from 365 to 700 nm and generates an acid by heat. In formula (I), U and V each independently represent a divalent organic group; and V represents a group including an aliphatic structure having 1 to 30 carbon atoms, or U represents a group including an aliphatic structure having 2 to 30 carbon atoms that constitute the main chain. |
