发明名称 液相拡散接合用のNi系合金
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an alloy for liquid-phase diffusion bonding capable of improving the quality of the bonded component after liquid-phase diffusion bonding by optimizing the alloy composition of a joining material. <P>SOLUTION: The Ni-based alloy for liquid-phase diffusion bonding contains, by atom, 1-20% Co, 10-22% B, 1-10% one of or total of both W and Mo,≤10% Fe, and the balance Ni with inevitable impurities, or further contains at least one of 0.1-20% Cr, 0.1-10% V. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5691897(B2) 申请公布日期 2015.04.01
申请号 JP20110150723 申请日期 2011.07.07
申请人 发明人
分类号 B23K35/30;C22C19/03;C22C19/05;C22C45/04 主分类号 B23K35/30
代理机构 代理人
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