| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the size of a cooling fan thereby reducing the size of the entire device in a semiconductor power conversion device when multiple semiconductors are mounted on cooling bodies. <P>SOLUTION: Semiconductors are divided and disposed on two cooling bodies to prevent heat generated from the semiconductors on the windward side from affecting the semiconductors on the leeward side. Further, an air channel cooling an electrolytic capacitor is provided. This structure reduces the size of a cooling fan. <P>COPYRIGHT: (C)2012,JPO&INPIT |
