| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate, along with its manufacturing method, equipped with a through hole preventing disconnection of an electrode. <P>SOLUTION: An end face electrode 41 and a through hole 51 are formed in each ceramic green sheet before lamination, and no process such as punching is performed after lamination. Consequently, even if each ceramic green sheet has a very hard material, possibility of cracking at the time of process is reduced because the process is applied in the condition of thin sheet. Further, the possibility of deformation under punching of the end face electrode 41 and a circuit electrode 22 connected to the end face electrode 41 can be reduced. Thus, no disconnection occurs between the end face electrode 41 and the circuit electrode 22, for improved connection reliability. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
