静电式夹盘及其制造方法;Electrostatic chuck and Manufacturing method of the same

摘要

本发明提供一种静电式夹盘，系利用静电力固定晶圆(wafer)的静电式夹盘，其特征在于，包括：底材；吸附所述晶圆的吸附层；将所述吸附层黏合在所述底材上的黏合层；及在所述黏合层的露出面上形成的黏合层防侵蚀涂层。所述黏合层防侵蚀涂层是向所述黏合层的露出面喷射未加热的陶瓷粉(Ceramic Powder)而形成的。本发明还提供一种静电式夹盘的制造方法，包括：(a) 将由陶瓷片或绝缘树脂片构成的吸附层黏合在底材上，形成黏合层的步骤；及(b) 在所述黏合层的露出面上形成黏合层防侵蚀涂层的步骤。; an attracting layer for attracting the wafer; an adhesive layer for bonding the attracting layer to the base; and a coating layer preventing erosion of the adhesive layer formed on an exposed surface of the adhesive layer, wherein the coating layer is formed by spraying unheated ceramic powder to the exposed surface of the adhesive layer. The present invention also provides a method manufacturing an electrostatic chuck, the method including: (a) bonding an attracting layer consisted of a ceramic sheet or an insulation resin sheet to the base to form an adhesive layer; and (b) forming a coating layer preventing erosion of the adhesive layer on an exposed surface of the adhesive layer.