无电解钯敷液,申请号TW100138458-传众专利搜索

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法人/股东/高管

发明名称	无电解钯敷液
摘要
申请公布号	TWI479048	申请公布日期	2015.04.01
申请号	TW100138458	申请日期	2011.10.24
申请人	小岛化学药品股份有限公司	发明人	渡边秀人;小嶋和弘;八木薰
分类号	C23C18/44	主分类号	C23C18/44
代理机构		代理人	林志刚台北市中山区南京东路2段125号7楼
主权项	一种无电解钯镀敷液，其系含有钯化合物、胺化合物、硫化合物及还原剂之无电解钯镀敷液，其特征为具有以下(甲)及(乙)：(甲)前述硫化合物为选自于硫代乙醇酸、硫代二乙醇酸、硫代硫酸钠及亚硫酸钠，并含有0.01~10mol/l之量；(乙)前述还原剂为并用含有量0.05~1.0mol/l量之次亚磷酸化合物与含有量0.001~0.1mol/l量之甲酸或甲酸化合物。
地址	日本

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