发明名称 冷却装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cooling device capable of preventing the deformation of a heat reception part when thermally connecting the heat reception part to a heat source to maintain excellent thermal conductivity. <P>SOLUTION: The cooling device includes: screws 97 fixed to a board 96 with a heat source 92 being an object; coil springs 98 mounted to the screws 97; a mounting plate 95 energized toward the board 96 with the heat source 92 by the coil springs 98; and a heat reception plate 91 arranged away from the mounting plate 95 and abutting on the board 96 with the heat source 92. Thereby, the heat reception plate 91 abutting on the board 96 with the heat source 92 and the mounting plate 95 energized toward the board 96 with the heat source 92 by the coil springs 98 are formed with members different from each other, thereby an energization force of the coil springs 98 acts on the mounting plate 95 but does not directly act on the heat reception plate 91, whereby the deformation of the heat reception plate 91 can be prevented. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP5691756(B2) 申请公布日期 2015.04.01
申请号 JP20110083663 申请日期 2011.04.05
申请人 发明人
分类号 H01L23/40;H05K7/20 主分类号 H01L23/40
代理机构 代理人
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