| 发明名称 |
Transistor arrangement with semiconductor chips between two substrates |
| 摘要 |
An electronic device comprising a first substrate, a second substrate, a first semiconductor chip comprising a transistor, comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, and a second semiconductor chip comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, wherein the first semiconductor chip comprises a via electrically coupling a first transistor terminal at its first mounting surface with a second transistor terminal at its second mounting surface. |
| 申请公布号 |
US2015092375(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201314044232 |
申请日期 |
2013.10.02 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
Otremba Ralf;Hoeglauer Josef;Chong Chooi Mei |
| 分类号 |
H01L23/538;H01L21/02 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device, comprising:
a first substrate; a second substrate; a first semiconductor chip comprising a transistor, a first mounting surface bonded to the first substrate and a second mounting surface bonded to the second substrate; a second semiconductor chip comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate; wherein the first semiconductor chip comprises a via electrically coupling a first transistor terminal at its first mounting surface with a second transistor terminal at its second mounting surface. |
| 地址 |
Villach AT |
