| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame for an integrated circuit (IC) card having high rigidity without an additional fixing jig, and provide a manufacturing method of the lead frame. <P>SOLUTION: The lead frame is made up of a lead frame material including iron-nickel alloy or copper, a heat resistant tape is attached to a plurality of specific patterns having openings therein, and a contact terminal pattern is attached to the other surface of the heat resistant tape. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
