| 摘要 |
本发明系关于一种制造电子装置之方法，其包括：选择性地施加表面处理，以改变表面层之第一或第二区域之表面能，以使得第一溶液在沉积于该第一区域上时之接触角大于该第一溶液在沉积于该第二区域上时之接触角，该第一区域围绕并毗邻该第二区域；及在该表面层上沉积界定井之护堤结构，该护堤结构包括电绝缘材料并围绕该第一区域；将该第一溶液沉积于该表面层之该第二区域上，并乾燥该沉积的第一溶液，以形成层；及将第二溶液沉积于该由该第一溶液所形成之层上及该第一表面层区域上，其中该沉积的第一溶液在该表面层之该等第一及第二区域间之边界上具有钉扎点，且该沉积的第二溶液具有不同的钉扎点。; and depositing on the surface layer a bank structure defining a well, said bank structure comprising electrically insulating material and surrounding said first region; depositing said first solution onto the second region of said surface layer and drying said deposited first solution to form a layer; and depositing a second solution over the layer formed by the first solution and onto the first surface layer region, wherein the deposited first solution has a pinning point at a boundary between said first and second regions of said surface layer and the deposited second solution has a different pinning point. |
