| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of dividing a ceramic chip capacitor sheet in which the ceramic chip capacitor sheet can be easily divided even by a single-spindle cutting device. <P>SOLUTION: There is provided the method of dividing a ceramic chip capacitor sheet 11 formed by laminating a ceramic layer atop, the method including an alignment mark exposure step of forming cutting grooves 23a-23f having a width equal to or larger than the thickness of a cutting blade by cutting an alignment region 19 a plurality of times with the cutting blade, and thus exposing alignment marks 19a on bottom parts of the cutting grooves; an alignment step of detecting division positions on the basis of the alignment marks exposed in the alignment mark exposure step; and a division step of dividing the ceramic chip capacitor sheet into individual chip capacitors by cutting the division positions detected in the alignment step with the cutting blade. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
