| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for removing metals such as nickel, copper, and iron contained in an alkaline polishing liquid used in a machining process for semiconductor wafers, and a device therefor. <P>SOLUTION: (1) The alkaline polishing liquid for the semiconductor wafers is circulated through a carbon fiber filter, so as to allow metals (nickel, copper, iron, and the like) contained in the polishing liquid to be removed. The removal of the metals is carried out on the surface of carbon fibers by allowing electrons emitted by an oxidation reaction of silicon in the polishing liquid to reduce and precipitate the metals. (2) The device 1 for removing the metals is installed with the carbon fiber filter 3 and includes: a device body 2 configured to circulate the polishing liquid 7 through the carbon fiber filter; a supply pipe 4 for supplying the polishing liquid to the device body; a discharge pipe 5 for discharging; and a pump 6 for supplying the polishing liquid to the device body and discharging it. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
