发明名称 |
Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy |
摘要 |
<p>A method is disclosed for making a wafer-level package for a plurality of MEMS devices. The method involves preparing a MEMS wafer and a lid wafer, each having respective bonding structures. The lid and MEMS wafers are then bonded together through the bonding structures. The wafers are substantially free of alkali metals and/or chlorine. IN a preferred embodiment, each wafer has a seed layer, a structural underlayer and an anti-oxidation layer. A solder layer, normally formed on the lid wafer, bonds the two wafers together.</p> |
申请公布号 |
EP1544164(B1) |
申请公布日期 |
2015.04.01 |
申请号 |
EP20040106449 |
申请日期 |
2004.12.09 |
申请人 |
TELEDYNE DALSA SEMICONDUCTOR INC. |
发明人 |
OUELLET, LUC;TURCOTTE, KARINE |
分类号 |
B81B7/00;B81C1/00;H01L21/00;H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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