发明名称 半導体装置の製造方法、基板処理方法及び基板処理装置
摘要 <p>There is provided a method for manufacturing a semiconductor device, including forming a film on a substrate by performing a cycle one or more times. The cycle includes forming a first layer containing silicon, nitrogen, and carbon by supplying a first silane-based source having a halogen-based ligand to the substrate and supplying a second silane-based source having amino groups to the substrate. The cycle also includes forming a second layer by modifying the first layer by performing supplying a reactive gas different from each of the sources, to the substrate.</p>
申请公布号 JP5693688(B2) 申请公布日期 2015.04.01
申请号 JP20130194992 申请日期 2013.09.20
申请人 发明人
分类号 H01L21/318;C23C16/42;H01L21/31;H01L21/316 主分类号 H01L21/318
代理机构 代理人
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